JPH02132945U - - Google Patents
Info
- Publication number
- JPH02132945U JPH02132945U JP4270189U JP4270189U JPH02132945U JP H02132945 U JPH02132945 U JP H02132945U JP 4270189 U JP4270189 U JP 4270189U JP 4270189 U JP4270189 U JP 4270189U JP H02132945 U JPH02132945 U JP H02132945U
- Authority
- JP
- Japan
- Prior art keywords
- block
- semiconductor device
- insertion hole
- spacer block
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4270189U JPH02132945U (en]) | 1989-04-11 | 1989-04-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4270189U JPH02132945U (en]) | 1989-04-11 | 1989-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02132945U true JPH02132945U (en]) | 1990-11-05 |
Family
ID=31554474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4270189U Pending JPH02132945U (en]) | 1989-04-11 | 1989-04-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02132945U (en]) |
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1989
- 1989-04-11 JP JP4270189U patent/JPH02132945U/ja active Pending